Screwless semiconductor processing chambers

ABSTRACT

In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to U.S. Provisional PatentApplication No. 62/719,562, filed on Aug. 17, 2018, which isincorporated by reference herein in its entirety.

BACKGROUND

With advances of electronic products, semiconductor technology has beenwidely applied in manufacturing memories, central processing units(CPUs), liquid crystal displays (LCDs), light emission diodes (LEDs),laser diodes and other devices or chip sets. In order to achievehigh-integration and high-speed requirements, dimensions ofsemiconductor integrated circuits have been reduced and variousmaterials and techniques have been proposed to achieve theserequirements and overcome obstacles during manufacturing. Controllingthe conditions of processing wafers within chambers is an important partof semiconductor fabrication technology.

Chamber components are typically assembled using screws. However, thechamber components assembled using screws may incur damage duringlocking and loosening of the screws. Also, the screws themselves maybecome damaged due to use and may corrode over time. Therefore,conventional techniques for chamber component assembly are not entirelysatisfactory.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that various features are not necessarily drawn to scale. In fact,the dimensions and geometries of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIG. 1 is a side view illustration of a screwless semiconductorprocessing chamber with a screwless gas distributor assembly and ascrewless chuck assembly, in accordance with some embodiments.

FIG. 2A is a side view illustration of the first gas distributorportion, in accordance with certain embodiments.

FIG. 2B is a plan view illustration of the first gas distributorportion, in accordance with certain embodiments.

FIG. 3A is a side view illustration of the second gas distributorportion, in accordance with certain embodiments.

FIG. 3B is a plan view illustration of the second gas distributorportion in a disassembled form, in accordance with certain embodiments.

FIG. 4 is a plan sectional view illustration of the second gasdistributor portion assembled with the first gas distributor portion, inaccordance with certain embodiments.

FIG. 5A is a side view of the first chuck portion, in accordance withsome embodiments.

FIG. 5B is a side view of the second chuck portion, in accordance withsome embodiments.

FIG. 6A is a perspective view of the first chuck portion and the secondchuck portion in a disassembled form, in accordance with someembodiments.

FIG. 6B is a perspective view of the first chuck portion and the secondchuck portion in an assembled form, in accordance with some embodiments.

FIG. 7 is a block diagram of a screwless semiconductor chamberfunctional module of a screwless semiconductor chamber, in accordancewith some embodiments.

FIG. 8 is a flow chart of a screwless semiconductor chamber process, inaccordance with some embodiments.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

The following disclosure describes various exemplary embodiments forimplementing different features of the subject matter. Specific examplesof components and arrangements are described below to simplify thepresent disclosure. These are, of course, merely examples and are notintended to be limiting. For example, it will be understood that when anelement is referred to as being “connected to” or “coupled to” anotherelement, it may be directly connected to or coupled to the otherelement, or one or more intervening elements may be present.

In addition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

Systems and methods in accordance with various embodiments are directedto screwless semiconductor chambers. A screwless semiconductor chamberis a semiconductor chamber with separate parts that are assembledtogether without the use of screws or nails. Rather, the various partsare capable of assembly together via various contours and features onthe parts themselves. In certain embodiments, the various parts mayassemble together utilizing the various contours and features on theparts with the aid of gravity and/or specific pieces that provideadherence in a non-rigid manner (e.g., without the use of screws ornails). For example, parts of the semiconductor chamber may be assembledtogether utilizing, for example, a mortise joint, a tenon joint, aninner spiral, location pinning, snaps, and/or building blocks.

In various embodiments, certain parts of a screwless semiconductorchamber may be screwless, or assembled without screws or nails, whileother parts of the screwless semiconductor chamber may utilize screwsfor assembly. For example, a screwless gas distributor assembly and/orscrewless chuck assembly (e.g., an electrostatic chuck) may be assembledin a screwless manner. Such a screwless gas distributor assembly mayinclude joints that interlock, such as with a combination of a mortisehole and a tenon tongue. As another example, a screwless chuck assemblymay be assembled as an upper site (e.g., a first portion) to a lowersite (e.g., a second portion) with an inner spiral protruding out of theupper site into the lower site and a location pin to control angularmovement between the upper site and the lower site.

In certain embodiments, a chamber for semiconductor processing mayinclude a gas distributor assembly configured to dispense gas into thechamber and a chuck assembly configured to secure a wafer within thechamber. Either, or both, of the gas distributor assembly and the chuckassembly may be formed of a first portion comprising a convexprotrusion, and a second portion comprising a concave opening. Thisconvex protrusion may be configured to enter (e.g., configured toengage) the concave opening to secure the first and second portionstogether. Stated another way, no screws or nails are utilized to securethe first and second portions together.

In various embodiments where the first and second portions are part of agas distributor assembly, this convex portion may be a tenon tongue andthe concave opening a mortise hole. For example, the second portion mayform a ring (also referred to as a second portion gas distributor ring)around the first portion (also referred to as a first portion gasdistributor shower head). Then, various tenon tongues, or convexprotrusions, extending radially from the first portion may be configuredto interface with and enter various mortise holes, or concave holes, ofthe second portion disposed radially around the first portion. Inparticular embodiments, the second portion may be formed of multiplepieces that are welded or otherwise adhered together without the use ofnails or screws. For example, each piece of the second portion piecesmay be injection molded (e.g., formed or constructed with an injectionmold) with respective mortise holes, put together with the firstportion, and then welded together to assemble the first and secondportions of the gas distributor assembly. In specific embodiments, thetenon tongue (e.g., convex protrusion) within the mortise hole (e.g.,concave opening) may be flush with (e.g., in contact with an entiretyof) a surface of the mortise hole (e.g., concave opening).

In certain embodiments, the first and second portions may be part of achuck assembly. As part of the chuck assembly, the convex portion mayprotrude from a center of the first portion and the concave portion maybe located at a center of the second portion. Also, the first portionmay include a first location pin concavity and the second portioncomprises a second location pin concavity. A location pin may beconfigured to be disposed within the first location pin concavity andthe second location pin concavity to secure the first portion to thesecond portion (e.g., to stop the portions from rotating relative to theother).

FIG. 1 is a side view illustration of a screwless semiconductorprocessing chamber 102 with a screwless gas distributor assembly 104A,104B and a screwless chuck assembly 106A, 106B, in accordance with someembodiments. The screwless semiconductor processing chamber 102 may alsoinclude a power supply 108, a supporter 110, and a conduit 112 amongother components illustrated in FIG. 1 that will be discussed furtherbelow. The screwless gas distributor assembly 104A, 104B, and screwlesschuck assembly 106A, 106B, may be within an enclosure 114 substantiallysurrounded by walls 116 of the screwless semiconductor processingchamber 102.

The supporter 110 is connected to, and supports, the screwless chuckassembly 106A, 106B. The screwless gas distributor assembly 104A, 104Bis disposed over the screwless chuck assembly 106A, 106B. Stated anotherway, the screwless chuck assembly 106A, 106B is underneath or under thescrewless gas distributor assembly 104A, 104B. The conduit 112 isconnected to the screwless gas distributor assembly 104A, 104B andprovides a gas 120 to the enclosure 114 by way of the openings 124. Incertain embodiments, the power supply 108 is coupled to the screwlessgas distributor assembly 104A, 104B to ionize the gas 120 so as togenerate plasma in the enclosure 114. In various embodiments, a wafer126 may be disposed on the screwless chuck assembly 106A, 106B. As notedabove, the screwless gas distributor assembly 104A, 104B may be disposedover the screwless chuck assembly 106A, 106B.

In certain embodiments, the openings 124 are uniformly distributed onthe screwless gas distributor assembly 104A, 104B in concentric ringsspaced various distances from a center point. The dimensions and numberof the openings 124 may determine the amount of gas distribution withinthe enclosure 114. For example, if a high gas amount at the edge of thescrewless gas distributor assembly 104A, 104B is desired, more or largeropenings 124 may be configured at the edge of the screwless gasdistributor assembly 104A, 104B. In contrast, if a high gas amount atthe center of the screwless gas distributor assembly 104A, 104B isdesired, more or larger openings 124 may be configured at the center ofthe screwless gas distributor assembly 104A, 104B.

The screwless semiconductor processing chamber 102 may be an etchapparatus, chemical vapor deposition (CVD) chamber, physical vapordeposition (PVD) chamber, atomic layer deposition (ALD) chamber, remoteplasma enhanced chemical vapor deposition (RPECVD) chamber, liquidsource misted chemical deposition (LSMCD) chamber, furnace chamber,single wafer furnace chamber or other chamber in which chemicals, gas orplasma is provided via the screwless gas distributor assembly 104A,104B.

The wafer 126 may be, for example, a silicon substrate, a III-V compoundsubstrate, a glass substrate, a liquid crystal display (LCD) substrate,a printed circuit board (PCB) or any other substrate similar thereto. Insome embodiments, the wafer 126 can be a blank substrate or comprise avariety of integrated devices or circuits, or layers for forming such,(not shown) thereon, for example.

The conduit 112 may be adapted to deliver the gas 120 to the screwlessgas distributor assembly 104A, 104B for introduction into the enclosure114 by way of the openings 124. The screwless chuck assembly 106A, 106Bmay be adapted to accommodate and hold the wafer 126. For example, thescrewless chuck assembly 106A, 106B may comprise an electrostatic chuck,vacuum system, clamp or other apparatus that is able to keep the wafer126 substantially on the screwless chuck assembly 106A, 106B. In someembodiments, a conduit 130 connected to an exhaust pump may exhaustgases or plasmas from the enclosure 114.

The gas 120 can be, for example, a pure chemical gas, a mixed chemicalgas, a mist or moisture of chemical, an ionized gas, liquid, or othertype of chemical. The gas 120 may be provided in the enclosure 114 wayof the openings 124.

The power supply 108 can be, for example, a radio frequency (RF) powersupply or other power supply that is adapted to provide a high voltagesufficient to ionize the gas 120 provided from the conduit 260 and togenerate plasma in the screwless semiconductor processing chamber 102.In some embodiments, the screwless semiconductor processing chamber 102is a single wafer furnace apparatus. For such embodiments, the powersupply 108 can be eliminated, because generation of plasma is notrequired. Accordingly, one skilled in the art is able to select, forexample, the screwless chuck assembly 106A, 106B, the screwless gasdistributor assembly 104A, 104B, the power supply 108, the conduit 112and/or the supporter 110 to provide a desired screwless semiconductorprocessing chamber 102.

In some embodiments, the screwless chuck assembly 106A, 106B includes afirst chuck portion 106A and a second chuck portion 106B. The firstchuck portion 106A may be part of an electrostatic chuck configured toadhere the wafer 126 to the screwless chuck assembly 106A, 106B viaelectrostatic forces. The supporter 110 may be connected to and supportthe screwless chuck assembly 106A, 106B while a process is executed.

For example, the first chuck portion 106A may be connected to a firstchuck portion power supply 127 (e.g., a direct current (DC) generator),and positive charges or negative charges are distributed on the firstchuck portion 106A by the first chuck portion power supply 127. Theelectric charges on the first chuck portion 106A may induce anelectrostatic field such that the wafer 126 is chucked or dechucked. Thesecond chuck portion 106B may be a bottom electrode coupled to a secondchuck portion power supply 128 so as to enhance plasma within theenclosure 114. Stated another way, the second chuck portion 106B maycontrol the reaction speed of plasma when plasma is generated in theenclosure 114.

Accordingly, the wafer 126 is put on the first chuck portion 106A, andan electrostatic field is induced by supplying power to the first chuckportion 106A on the upper surface of the electrostatic chuck 25.Positive charges accumulate on the first chuck portion 106A connected tothe first chuck portion power supply 127, and negative chargesaccumulate on the lower surface of the wafer 126 by plasma generated onan upper portion of the wafer 126, thereby inducing an electrostaticfield between the wafer 126 and the first chuck portion 106A. When theupper surface of the first chuck portion 106A is completely in contactwith the wafer 126, a clamping force is produced by the electrostaticfield, and thus the wafer is chucked.

In certain embodiments, the first chuck portion 106A may include a firstchuck portion convex protrusion 130A and the second chuck portion 106Bmay include a second chuck portion concave opening 130B. The first chuckportion convex protrusion 130A may be configured to enter (e.g.,configured to engage) the second chuck portion concave opening 130B andsit flush against a surface of the second chuck portion concave opening130B. Also, the first chuck portion convex protrusion 130A may orientthe first chuck portion 106A so that the first chuck portion 106A doesnot move laterally (e.g., along a horizontal axis) relative to thesecond chuck portion 106B. In certain embodiments, the first chuckportion convex protrusion 130A may be along a center axis 132 (e.g., arotational axis orthogonal to the horizontal axis) of both the firstchuck portion 106A and the second chuck portion 106B. Also, the secondchuck portion concave opening 130B may also be along the center axis 132(e.g., the rotational axis orthogonal to the horizontal axis) of boththe first chuck portion 106A and the second chuck portion 106B and thesecond chuck portion concave opening 130B.

In various embodiments, the first chuck portion 106A may include a firstlocation pin concavity 140A and the second chuck portion 106B mayinclude a second location pin concavity 140B. A location pin may 142 beconfigured to be disposed within the first location pin concavity 140Aand the second location pin concavity 140B to secure the first chuckportion 106A to the second chuck portion 106B (e.g., to stop one of thefirst chuck portion 106A or the second chuck portion 106B from rotatingrelative to the other around the center axis 132).

In various embodiments, the screwless gas distributor assembly 104A,104B may include a first gas distributor portion 104A and a second gasdistributor portion 104B. The second gas distributor portion 104B mayform a ring laterally around the first gas distributor portion 104A(e.g., to laterally surround the first gas distributor portion 104A).Also, the first gas distributor portion 104A may include a first gasdistributor portion convex protrusion 150A and the second gasdistributor portion 104B may include a second gas distributor portionconcave opening 150B. The first gas distributor portion convexprotrusion 150A may be configured to enter (e.g., configured to engage)the second gas distributor portion concave opening 150B and sit flushagainst a surface of the second gas distributor portion concave opening150B. Also, the first gas distributor portion convex protrusion 150A mayorient the first gas distributor portion 104A so that the first gasdistributor portion 104A does not move laterally (e.g., along ahorizontal axis orthogonal to the rotational axis) relative to thesecond gas distributor portion 104B.

In various embodiments, the first gas distributor portion convexprotrusion 150A may be a tenon tongue and the second gas distributorportion concave opening 150B may be a mortise hole. For example, thesecond gas distributor portion 104B may form a ring around the first gasdistributor portion 104A. Then, various tenon tongues, or first gasdistributor portion convex protrusions 150A, extending radially from thefirst gas distributor portion 104A may be configured to interface withand enter various mortise holes, or second gas distributor portionconcave opening 150B, of the second gas distributor portion 104Bdisposed radially around the first gas distributor portion 104A.

In particular embodiments, the second gas distributor portion 104B maybe formed of multiple pieces that are welded or otherwise adheredtogether without the use of nails or screws. For example, each piece ofthe second gas distributor portion pieces may be injection molded withrespective mortise holes, assembled with the first gas distributorportion 104A, and then welded together to assemble the first gasdistributor portion 104A and the second gas distributor portion 104B ofthe screwless gas distributor assembly 104A, 104B.

FIG. 2A is a side view illustration of the first gas distributor portion104A, in accordance with certain embodiments. As illustrated, the firstgas distributor portion 104A may include a first gas distributor portionconvex protrusion 150A. The first gas distributor portion convexprotrusion 150A may be configured to enter (e.g., configured to engage)the second gas distributor portion concave opening and sit flush againsta surface of the second gas distributor portion concave opening.

As discussed above, in certain embodiments, the openings 124 may beuniformly distributed on the screwless gas distributor assembly 104A,104B in concentric rings spaced various distances from a center pint.The dimensions and number of the openings 124 may determine the amountof gas distribution within the enclosure 114. For example, if a high gasamount at the edge of the screwless gas distributor assembly 104A, 104Bis desired, more or larger openings 124 may be configured at the edge ofthe screwless gas distributor assembly 104A, 104B. In contrast, if ahigh gas amount at the center of the screwless gas distributor assembly104A, 104B is desired, more or larger openings 124 may be configured atthe center of the screwless gas distributor assembly 104A, 104B.

FIG. 2B is a plan view illustration of the first gas distributor portion104A, in accordance with certain embodiments. As illustrated, the firstgas distributor portion 104A may include a first gas distributor portionconvex protrusion 150A (e.g., a plurality of first gas distributorportion convex protrusions 150A). More specifically, each of the firstgas distributor portion convex protrusions 150A may be configured toenter (e.g., configured to engage), and sit flush against a surface of,a respective one of the second gas distributor portion concave openings.

FIG. 3A is a side view illustration of the second gas distributorportion 104B, in accordance with certain embodiments. The second gasdistributor portion 104B may form a ring laterally around the first gasdistributor portion. Also, the second gas distributor portion 104B mayinclude a second gas distributor portion concave opening 150B. The firstgas distributor portion convex protrusion may be configured to enter(e.g., configured to engage) the second gas distributor portion concaveopening 150B and sit flush against a surface of the second gasdistributor portion concave opening 150B. Also, a top part 158A of thesecond gas distributor portion concave opening 150B may be shorter alonga horizontal axis 159A and wider along a vertical axis 159B than abottom part 158B of the second gas distributor portion concave opening150B.

FIG. 3B is a plan view illustration of the second gas distributorportion 104B in a disassembled form, in accordance with certainembodiments. By being in a disassembled form, the second gas distributorportion 104B may be in separate pieces 160A, 160B, 160C, 160D. Theseseparate pieces may be welded or otherwise adhered together without theuse of nails or screws to assemble the second gas distributor portion104B with the first gas distributor portion 104A. For example, eachpiece of the second portion pieces 160A, 160B, 160C, 160D may beinjection molded with respective mortise holes, assembled with the firstportion, and then welded together to fully assemble the first and secondportions of the gas distributor assembly. In specific embodiments, thetenon tongue (e.g., convex protrusion) within the mortise hole (e.g.,concave opening) may be flush with a surface of the mortise hole (e.g.,concave opening).

As noted above, the second gas distributor portion 104B may form a ringlaterally around the first gas distributor portion. Also, the second gasdistributor portion 104B may include a second gas distributor portionconcave opening 150B. The first gas distributor portion convexprotrusion may be configured to enter (e.g., configured to engage) thesecond gas distributor portion concave opening 150B and sit flushagainst a surface of the second gas distributor portion concave opening150B.

FIG. 4 is a plan sectional view illustration of the second gasdistributor portion 104B assembled with the first gas distributorportion 104A, in accordance with certain embodiments. By being in anassembled form, the separate pieces 160A, 160B, 160C, 160D of the secondgas distributor portion 104B may be welded or otherwise adhered togetherwithout the use of nails or screws to fully assemble the second gasdistributor portion 104B with the first gas distributor portion 104A.For example, each piece of the second portion pieces may be injectionmolded with respective mortise holes, assembled with the first portion,and then welded together to fully assemble the first and second portionsof the gas distributor assembly. As noted above, the second gasdistributor portion 104B may form a ring laterally around the first gasdistributor portion. Also, the second gas distributor portion 104B mayinclude a second gas distributor portion concave opening.

FIG. 5A is a side view of the first chuck portion 106A, in accordancewith some embodiments. The first chuck portion 106A may include a firstchuck portion convex protrusion 130A. The first chuck portion convexprotrusion 130A may be configured to enter (e.g., configured to engage)the second chuck portion concave opening and sit flush against a surfaceof the second chuck portion concave opening. Also, the first chuckportion convex protrusion 130A may orient the first chuck portion 106Aso that the first chuck portion 106A does not move laterally (e.g.,along the horizontal axis 159A) relative to the second chuck portion. Incertain embodiments, the first chuck portion convex protrusion 130A maybe along the center axis 132 (e.g., a rotational axis orthogonal to thehorizontal axis 159A) of the first chuck portion 106A. Also, in variousembodiments, the first chuck portion 106A may include a first locationpin concavity 140A.

FIG. 5B is a side view of the second chuck portion 106B, in accordancewith some embodiments. The second chuck portion 106B may include asecond chuck portion concave opening 130B. The first chuck portionconvex protrusion may be configured to enter (e.g., configured toengage) the second chuck portion concave opening 130B and sit flushagainst a surface of the second chuck portion concave opening 130B. Incertain embodiments, the second chuck portion concave opening 130B mayalso be along the center axis 132 (e.g., the rotational axis orthogonalto the horizontal axis 159A) of the second chuck portion 106B and thesecond chuck portion concave opening 130B. In various embodiments, thesecond chuck portion 106B may include a second location pin concavity140B.

FIG. 6A is a perspective view of the first chuck portion 106A and thesecond chuck portion 106B in a disassembled form, in accordance withsome embodiments. By being in a disassembled form, the first chuckportion 106A may not be touching and may be separated from the secondchuck portion 106B. As noted above, the first chuck portion 106A mayinclude a first chuck portion convex protrusion 130A and the secondchuck portion 106B may include a second chuck portion concave opening130B. The first chuck portion convex protrusion 130A may be configuredto enter (e.g., configured to engage) the second chuck portion concaveopening 130B and sit flush against a surface of the second chuck portionconcave opening 130B. Also, the first chuck portion convex protrusion130A may orient the first chuck portion 106A so that the first chuckportion 106A does not move laterally (e.g., along a horizontal axis)relative to the second chuck portion 106B. In certain embodiments, thefirst chuck portion convex protrusion 130A may be along the center axis132 (e.g., the rotational axis orthogonal to the horizontal axis) ofboth the first chuck portion 106A and the second chuck portion 106B.Also, the second chuck portion concave opening 130B may also be alongthe center axis 132 (e.g., the rotational axis orthogonal to thehorizontal axis 159A) of both the first chuck portion 106A and thesecond chuck portion 106B and the second chuck portion concave opening130B.

In various embodiments, the first chuck portion 106A may include a firstlocation pin concavity 140A and the second chuck portion 106B mayinclude a second location pin concavity 140B. A location pin may 142 beconfigured to be disposed within the first location pin concavity 140Aand the second location pin concavity 140B to secure the first chuckportion 106A to the second chuck portion 106B (e.g., to stop one of thefirst chuck portion 106A or the second chuck portion 106B from rotatingrelative to the other around the center axis 132).

FIG. 6B is a perspective view of the first chuck portion 106A and thesecond chuck portion 106B in an assembled form, in accordance with someembodiments. By being in the assembled form, the first chuck portion106A may touch and sit on the second chuck portion 106B. Also, the firstchuck portion convex protrusion 130A may be within the second chuckportion concave opening 130B and sit flush against a surface of thesecond chuck portion concave opening 130B. Additionally, the locationpin may 142 be configured to be disposed within the first location pinconcavity 140A and the second location pin concavity 140B to secure thefirst chuck portion 106A to the second chuck portion 106B (e.g., to stopone of the first chuck portion 106A or the second chuck portion 106Bfrom rotating relative to the other around the center axis 132).

FIG. 7 is a block diagram of a screwless semiconductor chamberfunctional module of 702 a screwless semiconductor chamber, inaccordance with some embodiments. The screwless semiconductor chamberfunctional module may include a processor 704. In further embodiments,the processor 704 may be implemented as one or more processors.

The processor 704 may be operatively connected to a computer readablestorage module 706 (e.g., a memory and/or data store), a controllermodule 708 (e.g., a controller), a user interface module 710 (e.g., auser interface), and a network connection module 712 (e.g., networkinterface). In some embodiments, the computer readable storage module706 may include screwless semiconductor chamber logic that may configurethe processor 704 to perform various processes discussed herein. Thecomputer readable storage may also store data, such as identifiers for awafer, identifiers for a screwless semiconductor chamber, identifiersfor particular gas or plasma, and any other parameter or informationthat may be utilized to perform the various processes discussed herein.

The screwless semiconductor chamber functional module 702 may include acontroller module 708. The controller module 708 may be configured tocontrol various physical apparatuses that control movement orfunctionality for a supporter, screwless gas distributor assembly,screwless chuck assembly, and the like. For example, the controllermodule 708 may be configured to control movement or functionality for atleast one of a robotic arm that moves the wafer, an actuator for thesupporter of the screwless chuck assembly, and the like. For example,the controller module 708 may control a motor or actuator that may moveor activate at least one of a robotic arm (discussed further below),and/or supporter. The controller may be controlled by the processor andmay carry out aspects of the various processes discussed herein.

The screwless semiconductor chamber functional module 702 may alsoinclude the user interface module 710. The user interface module mayinclude any type of interface for input and/or output to an operator ofthe screwless semiconductor chamber functional module 702, including,but not limited to, a monitor, a laptop computer, a tablet, or a mobiledevice, etc.

The network connection module 712 may facilitate a network connection ofthe screwless semiconductor chamber functional module 702 with variousdevices and/or components of the screwless semiconductor chamberfunctional module 702 that may communicate (e.g., send signals,messages, instructions, or data) within or external to the screwlesssemiconductor chamber functional module 702. In certain embodiments, thenetwork connection module 712 may facilitate a physical connection, suchas a line or a bus. In other embodiments, the network connection module712 may facilitate a wireless connection, such as over a wireless localarea network (WLAN) by using a transmitter, receiver, and/ortransceiver. For example, the network connection module 712 mayfacilitate a wireless or wired connection with the sensor 714, theprocessor 704, the computer readable storage 706, and the controller708.

FIG. 8 is a flow chart of a screwless semiconductor chamber process 800,in accordance with some embodiments. The screwless semiconductor chamberprocess 800, may be performed using components of a screwlesssemiconductor chamber, as introduced above. It is noted that the process800 is merely an example, and is not intended to limit the presentdisclosure. Accordingly, it is understood that additional operations maybe provided before, during, and after the process 800 of FIG. 8 ,certain operations may be omitted, certain operations may be performedconcurrently with other operations, and that some other operations mayonly be briefly described herein.

At operation 802, a first portion with a convex protrusion may beconstructed or provided. As noted above, the first portion may be of,for example, any of a screwless gas distributor assembly or a screwlesschuck assembly. For example, the first portion may be constructed usingconventional injection molding techniques or assembled from smallerconstituent pieces to form the first portion.

At operation 804, a second portion with a concave opening may beconstructed or provided. As noted above, the second portion may be of,for example, any of the screwless gas distributor assembly or thescrewless chuck assembly of operation 802. For example, the secondportion may be constructed using conventional injection moldingtechniques or assembled from smaller constituent pieces to form thesecond portion.

At operation 806, the screwless gas distributor assembly or thescrewless chuck assembly may be assembled by connecting (e.g., placing)the convex protrusion into the concave opening. This assembly mayinclude moving the first portion and second portion together such thatdifferent structural features of the first portion and second portioninterlock.

In particular embodiments, other implements may also be included in theassembly of the first portion and the second portion, such as a locationpin connected or inserted into a respective first location pin concavityon the first portion and a second location pin concavity on the secondportion. As noted above, the location pin may be configured to bedisposed within the first location pin concavity and the second locationpin concavity to secure, for example, a first portion that is a firstchuck portion to a second portion that is a second chuck portion (e.g.,to stop one of the first chuck portion or the second chuck portion fromrotating relative to the other around a center axis).

At operation 808, a decision may be made as to whether additionalscrewless parts of a screwless semiconductor chamber are to beassembled. If there are additional screwless parts to be assembled(e.g., a screwless gas distributor assembly or a screwless chuckassembly), then the process 800 returns to operation 802. However, ifthere are no additional screwless parts to be assembled, then theprocess 800 proceeds to operation 810.

At operation 810, the screwless semiconductor chamber may be assembled.As noted above, the screwless semiconductor chamber may include at leastone of a screwless gas distributor assembly and a screwless chuckassembly. Accordingly, once the desired one or both of the screwless gasdistributor assembly and the screwless chuck assembly is constructed orprovided, then the rest of the screwless semiconductor chamber may beassembled and prepared for operation.

At operation 812, a wafer may be placed on the screwless chuck assembly.More specifically, the wafer may be placed on the a screwless chuckassembly within a screwless semiconductor chamber. The wafer may beplaced on the screwless chuck assembly via a robotic arm that may moveinto and out of the enclosure of the screwless semiconductor chamber viaa portal. The portal may be any region of the screwless semiconductorchamber configured to be opened and/or closed as desired to provideaccess to the enclosure region of the screwless semiconductor chamber.

At operation 814, a process may be performed on the wafer within thescrewless semiconductor chamber. The process may be, for example, anetch process, a chemical vapor deposition (CVD) process, a physicalvapor deposition (PVD) process, an atomic layer deposition (ALD)process, a remote plasma enhanced chemical vapor deposition (RPECVD)process, a liquid source misted chemical deposition (LSMCD) process,and/or any other process in which a chemical, gas or plasma is providedvia the screwless gas distributor assembly.

At operation 816, the wafer may be released upon the end of the process.For example, the wafer may be released by releasing the electrostaticforce that adheres the wafer to the screwless chuck assembly. Thus, thefreed wafer may be removed from the screwless semiconductor chamber by arobotic arm that may move into and out of the enclosure of the screwlesssemiconductor chamber via the portal.

In an embodiment, a system includes: a gas distributor assemblyconfigured to dispense gas into a chamber; and a chuck assemblyconfigured to secure a wafer within the chamber, wherein at least one ofthe gas distributor assembly and the chuck assembly includes: a firstportion comprising a convex protrusion, and a second portion comprisinga concave opening, wherein the convex protrusion is configured to engagethe concave opening.

In another embodiment, a system includes: a gas distributor assemblyconfigured to dispense gas into a chamber, wherein the gas distributorassembly includes: a first gas distributor portion comprising a convexprotrusion, and a second gas distributor portion comprising a concaveopening, wherein the convex protrusion is configured to engage theconcave opening; and a chuck assembly configured to secure a waferwithin the chamber, wherein the chuck assembly is underneath the gasdistributor assembly.

In another embodiment, a method includes: constructing a first portioncomprising a convex protrusion, constructing a second portion comprisinga concave opening, wherein the first portion and the second portion arepart of either: a gas distributor assembly configured to dispense gasinto a chamber, or a chuck assembly configured to secure a wafer withinthe chamber; and placing the convex protrusion within the concaveopening.

The foregoing outlines features of several embodiments so that thoseordinary skilled in the art may better understand the aspects of thepresent disclosure. Those skilled in the art should appreciate that theymay readily use the present disclosure as a basis for designing ormodifying other processes and structures for carrying out the samepurposes and/or achieving the same advantages of the embodimentsintroduced herein. Those skilled in the art should also realize thatsuch equivalent constructions do not depart from the spirit and scope ofthe present disclosure, and that they may make various changes,substitutions, and alterations herein without departing from the spiritand scope of the present disclosure.

In this document, the term “module” as used herein, refers to software,firmware, hardware, and any combination of these elements for performingthe associated functions described herein. Additionally, for purpose ofdiscussion, the various modules are described as discrete modules;however, as would be apparent to one of ordinary skill in the art, twoor more modules may be combined to form a single module that performsthe associated functions according embodiments of the invention.

A person of ordinary skill in the art would further appreciate that anyof the various illustrative logical blocks, modules, processors, means,circuits, methods and functions described in connection with the aspectsdisclosed herein can be implemented by electronic hardware (e.g., adigital implementation, an analog implementation, or a combination ofthe two), firmware, various forms of program or design codeincorporating instructions (which can be referred to herein, forconvenience, as “software” or a “software module), or any combination ofthese techniques. To clearly illustrate this interchangeability ofhardware, firmware and software, various illustrative components,blocks, modules, circuits, and steps have been described above generallyin terms of their functionality. Whether such functionality isimplemented as hardware, firmware or software, or a combination of thesetechniques, depends upon the particular application and designconstraints imposed on the overall system. Skilled artisans canimplement the described functionality in various ways for eachparticular application, but such implementation decisions do not cause adeparture from the scope of the present disclosure.

Furthermore, a person of ordinary skill in the art would understand thatvarious illustrative logical blocks, modules, devices, components andcircuits described herein can be implemented within or performed by anintegrated circuit (IC) that can include a general purpose processor, adigital signal processor (DSP), an application specific integratedcircuit (ASIC), a field programmable gate array (FPGA) or otherprogrammable logic device, or any combination thereof. The logicalblocks, modules, and circuits can further include antennas and/ortransceivers to communicate with various components within the networkor within the device. A general purpose processor can be amicroprocessor, but in the alternative, the processor can be anyconventional processor, controller, or state machine. A processor canalso be implemented as a combination of computing devices, e.g., acombination of a DSP and a microprocessor, a plurality ofmicroprocessors, one or more microprocessors in conjunction with a DSPcore, or any other suitable configuration to perform the functionsdescribed herein.

Conditional language such as, among others, “can,” “could,” “might” or“may,” unless specifically stated otherwise, are otherwise understoodwithin the context as used in general to convey that certain embodimentsinclude, while other embodiments do not include, certain features,elements and/or steps. Thus, such conditional language is not generallyintended to imply that features, elements and/or steps are in any wayrequired for one or more embodiments or that one or more embodimentsnecessarily include logic for deciding, with or without user input orprompting, whether these features, elements and/or steps are included orare to be performed in any particular embodiment.

Additionally, persons of skill in the art would be enabled to configurefunctional entities to perform the operations described herein afterreading the present disclosure. The term “configured” as used hereinwith respect to a specified operation or function refers to a system,device, component, circuit, structure, machine, etc. that is physicallyor virtually constructed, programmed and/or arranged to perform thespecified operation or function.

Disjunctive language such as the phrase “at least one of X, Y, or Z,”unless specifically stated otherwise, is otherwise understood with thecontext as used in general to present that an item, term, etc., may beeither X, Y, or Z, or any combination thereof (e.g., X, Y, and/or Z).Thus, such disjunctive language is not generally intended to, and shouldnot, imply that certain embodiments require at least one of X, at leastone of Y, or at least one of Z to each be present.

It should be emphasized that many variations and modifications may bemade to the above-described embodiments, the elements of which are to beunderstood as being among other acceptable examples. All suchmodifications and variations are intended to be included herein withinthe scope of this disclosure and protected by the following claims.

What is claimed is:
 1. A system, comprising: a gas distributor assemblyconfigured to dispense gas into a chamber; a chuck assembly configuredto secure a wafer within the chamber, wherein the chuck assemblycomprises: a first portion comprising a convex protrusion, and a secondportion comprising a concave opening, wherein the convex protrusion isconfigured to engage the concave opening; a first power supply coupledto the first portion and configured to induce an electrostatic fieldbetween the wafer and the first portion; and a second power supplycoupled to the second portion and configured to control reaction speedof a plasma when the plasma is generated in the chamber.
 2. The systemof claim 1, wherein the convex protrusion is a tenon tongue and theconcave opening is a mortise hole.
 3. The system of claim 1, wherein theconvex protrusion protrudes from a center of the first portion.
 4. Thesystem of claim 1, wherein the first portion comprises a first locationpin concavity and the second portion comprises a second location pinconcavity, wherein a location pin is configured to be disposed withinthe first location pin concavity and the second location pin concavity.5. The system of claim 1, wherein the gas distributor assembly comprisesthe first portion and the second portion.
 6. The system of claim 1,wherein both the gas distributor assembly and the chuck assemblycomprise a respective set of the first portion and the second portion.7. The system of claim 1, wherein the first portion is part of anelectrostatic chuck configured to adhere the wafer via electrostaticforces.
 8. The system of claim 1, wherein the first portion is disposedon the second portion.
 9. A system, comprising: a gas distributorassembly configured to dispense gas into a chamber, wherein the gasdistributor assembly comprises: a first gas distributor portioncomprising a first convex protrusion, and a second gas distributorportion comprising a first concave opening, wherein the convexprotrusion is configured to engage the concave opening; a chuck assemblyconfigured to secure a wafer within the chamber, wherein the chuckassembly is underneath the gas distributor assembly, wherein the chuckassembly comprises: a first portion configured to hold a wafer thereon,the first portion comprising a second convex protrusion, and a secondportion disposed under the first portion, the second portion comprisinga second concave opening, wherein the second convex protrusion isconfigured to engage the second concave opening; a first power supplycoupled to the first portion and configured to induce an electrostaticfield between the wafer and the first portion; and a second power supplycoupled to the second portion and configured to control reaction speedof a plasma when the plasma is generated in the chamber.
 10. The systemof claim 9, wherein the second gas distributor portion forms a ring thatsurround the first gas distributor portion.
 11. The system of claim 9,wherein the first gas distributor portion comprises multiple convexprotrusions and the second gas distributor portion comprises multipleconcave openings, wherein each of the multiple convex protrusions areconfigured to engage a respective one of the concave openings.
 12. Thesystem of claim 9, wherein the second gas distributor portion is formedof multiple pieces welded together.
 13. The system of claim 9, whereinthe first convex protrusion within the first concave opening is flushwith a surface of the first concave opening.
 14. The system of claim 9,wherein the first gas distributor portion and the second gas distributorportion are formed by an injection mold.
 15. The system of claim 9,wherein the first convex protrusion protrudes radially from the firstgas distributor portion.
 16. A system, comprising: a gas distributorassembly configured to dispense gas into a chamber, wherein the gasdistributor assembly comprises: a first gas distributor portioncomprising a convex protrusion, and a second gas distributor portioncomprising a concave opening, wherein the convex protrusion isconfigured to engage the concave opening; a chuck assembly configured tosecure a wafer within the chamber, wherein the chuck assembly comprisedcomprises: a first portion comprising a convex protrusion, and a secondportion comprising a concave opening, wherein the convex protrusion isconfigured to engage the concave opening; a first power supply coupledto the first portion and configured to induce an electrostatic fieldbetween the wafer and the first portion; and a second power supplycoupled to the second portion and configured to control reaction speedof a plasma when the plasma is generated in the chamber.
 17. The systemof claim 16, wherein the second gas distributor portion forms a ringthat surround the first gas distributor portion.
 18. The system of claim16, wherein the first gas distributor portion comprises multiple convexprotrusions and the second gas distributor portion comprises multipleconcave openings, wherein each of the multiple convex protrusions areconfigured to engage a respective one of the concave openings.
 19. Thesystem of claim 16, wherein the second gas distributor portion is formedof multiple pieces welded together.
 20. The system of claim 16, whereinthe convex protrusion within the concave opening is flush with a surfaceof the concave opening.